pkf series general information the macrodens? pkf family of true component level on-board dc/dc power modules are intended as distributed power sources in decentralized power systems. utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a mttf of more than 10 million hours. the high reliability and the very low heights of these dc/dc power modules makes them particularly suited for information technology and telecom (it&t) applications, with board spacing down to 15 mm or 0.6 in. they are optimized for an operational ambient temperature range in compliance ? smd and through hole versions with ultra-low component height 8.0 mm (0.315 in.) up to 87% efficiency at full load safety requirements in accordance with en60950 mttf >10 million hours at +50c case temperature (+40c ambient) low emi pkf series with present and future application needs, including non temperature controlled environments. the mechanical design offers surface mount and through- hole versions, delivered in ready-to-use tubes, trays or tape & reel packages, and compatibility with semi and fully aqueous cleaning processes. the pkf series is manufactured in highly automated production lines using smt, laser trimming, 100% burn-in and ate final inspection. ericsson microelectronics ab has been an iso 9001 certified supplier since 1991. for a complete product program please reference the back cover. patents us: d357901 de: m94022763
2 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 1) applies to through-hole versions 2) for surfacemount versions please see soldering profile page 4. environmental characteristics characteristics vibration (sinusoidal) jesd 22-b103 (iec 68-2-6 f c) test procedure & conditions mil-std-883 method 2026 (iec 68-2-34 e d) random vibration temperature change jesd 22-a104 (iec 68-2-14 n a) frequency amplitude acceleration number of cycles 10?500 hz 0.75 mm 10 g 10 in each axis frequency acceleration density spectrum duration reproducability 10?500 hz 0.5 g 2 /hz 10 min in 3 directions medium (iec 62-36) peak acceleration shock duration 200 g 3 ms duration temperature 96 h 35c jesd 22-a-a107 (iec 68-2-11 k a ) aggressive environment resistance to soldering temp 1) 2) jesd 22-b106 (iec 68-2-20 t b 1a) temperature, solder duration 260c 10...13 s high temp storage life jesd22-a10 temperature duration 125c 1000hrs lead integrity solderability jesd22-b105 number of cycles 2 jesd22-b102 operational life test temperature maximum load input voltage on input voltage off duration 85c 9min 3min 1000hrs moisture reflow senitive classification j-std-020 level 1 jesd 22-a101 (iec 68-2-3 c a with bias) temperature humidity duration 85c 85% rh 1000 hours shock (half sinus) jesd 22-b104 (iec 68-2-27 e a) temperature number of cycles ?40c?+125c 500 accelerated damp heat
3 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 3.6[0.142] 5.0[0.197] 24.0[0.945] 2 9.6[ 1.16 5] 2.8[0.110] 12 3456789 10 11 12 13 14 15 16 17 18 40.0[1.575] case the case consists of semiconductor grade epoxy with embedded pins. coefficient of thermal expansion (cte) is typ. 15 ppm/c. weight maximum 20 g (0.71 oz). connection pins base material is copper (cu), first plating is nickel (ni) and second (outer) plating is palladium (pd). dimensions in mm (in) mechanical data through-hole version
dimensions in mm (in) dimensions in mm (in) surface-mount version
4 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 thermal data two-parameter model this model provides a more precise description of the thermal char- acteristics to be used for thermal calculations. thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. the thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. one from case to ambient air and one from case to pb (printed circuit board). the thermal characteristics temperature can be calculated from the following formula: palladium plating is used on the terminal pins. a pin temperature (t p ) in excess of the solder fusing temperature (+183c for sn/pb 63/37) for more than 25 seconds and a peak temperature above 195c, is required to guarantee a reliable solder joint. both pin 1 and pin 11 must be monitored. no responsibility is assumed if these recommendations are not strictly followed. reflow soldering information the pkf series of dc/dc power modules are manufactured in sur- face mount technology. extra precautions must therefore be taken when reflow soldering the surface mount version. neglecting the soldering information given below may result in permanent damage or significant degradation of power module performance. the pkf series can be reflow soldered using ir, natural convection, forced convection or combined ir/convection technologies. the high thermal mass of the component and its effect on t (c) re- quires that particular attention be paid to other temperature sensi- tive components. ir reflow technology may require the overall profile time to be extended to approximately 8C10 minutes to ensure an acceptable t. higher activity flux may be more suitable to overcome the increase in oxidation and to avoid flux burn-up. the general profile parameters detailed in the diagram, with this ex- tended time to reach peak temperatures, would then be suitable. note! these are maximum parameters. depending on process varia- tions, an appropriate margin must be added. t pb = (t c Ct a )(r th cCpb +r th cCa )/r th cCa Cp d r th cCpb +t a where: p d : dissipated power, calculated as p o (l/hC1) t c : max average case temperature t a : ambient air temperature at the lower side of the power module t pb : temperature in the pb between the pkf connection pins r th c-pb : thermal resistance from case to pb under the power module r th c-a : thermal resistance from case to ambient air v: velocity of ambient air r th c-pb is constant and r th c-a is dependent on the air velocity. free convection is equal to an air velocity of aprox. 0.2 C 0.3 m/s. see figure below. figure 4 11 11
5 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 delivery package information tubes the pkf-series is delivered in tubes (designated by /a) with a length of 500 mm (19.69 in), see fig. 2. figure 2 specification material: antistatic coated pvc max surface resistance: 10 11 / color: transparent capacity: 10 power modules/tube weight: typ. 60 g end stops: pins trays smd versions, si, can be delivered in standard jedec trays (desig- nated by /b) on request, see fig. 3. for more information, please contact your local ericsson sales office. figure 3 specification material: polypropylene (pp) max temperature: 125oc max surface resistance: 10 5 / color: black tape & reel smd versions, si, can be delivered in standard tape & reel package (designated by /c) on request, see fig. 4. for more information, please contact your local ericsson sales office. figure 4 capacity: 15 power modules/tray stacking pitch: 10.16 mm weight: typ. 130 g min. order quantity: 150 pcs (one box contains 10 full trays) specification tape material: conductive polystyrene (ps) tape width: 72 mm tape pitch: 36 mm max surface resistance: 10 5 / tape color: black cover tape color: t ransparent reel diameter: 13" reel hub diameter: 4" reel capacity: 150 power modules/reel full reel weight: typ. 3.7 kg min. order quantity: 300 pcs (one box contains two reels) 9.5 (0.37) 1.1 (0.04) 35 (1.38) 15 (0.59) 11 (0.43) 14.5 (0.57) 24 (0.95) all dimensions in mm (in)
6 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 quality reliability meantime to fail (mttf) is calculated to >10 million hours at full output power and a case temperature of +50c (t a = +40c), using the ericsson failure rate data system. the ericsson failure rate data system is based on field failure rates and is continuously updated. the data corresponds to actual failure rates of components used in information technology and telecom equipment in temperature controlled environments (t a = C5 +65c). the data is considered to have a confidence level of 90%. for more information see design note 002. quality statement the products are designed and manufactured in an industrial environment where quality systems and methods like iso 9000, 6 and spc, are intensively in use to boost the continuous improvements strategy. infant mortality or early failures in the products are screened out by a burn-in procedure and an ate- based final test. conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. warranty ericsson microelectronics warrants to the original purchaser or end user that the products conform to this data sheet and are free from material and workmanship defects for a period of five (5) years from the date of manufacture, if the product is used within specified conditions and not opened. in case the product is discontinued, claims will be accepted up to three (3) years from the date of the discontinuation. for additional details on this limited warranty please refer to ericsson microelectronics abs general terms and conditions of sales, or individual contract documents. limitation of liability ericsson microelectronics does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a persons health or life). information given in this data sheet is believed to be accurate and reliable. no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of ericsson microelectronics. these products are sold only according to ericsson micro- electronics ? general conditions of sale, unless otherwise confirmed in writing. specifications subject to change without notice.
7 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001
ericsson microelectronics se-164 81 kista, sweden phone: +46 8 757 5000 www.ericsson.com/microelectronics for local sales contacts, please refer to our website or call: int. +46 8 757 4700, fax: +46 8 757 4776 en/lzt 146 57 r1a ? ericsson microelectronics ab, march 2001 data sheet the latest and most complete infor- mation can be found on our website! product program v i v o /i o max part no. smd p o max o/p 1 o/p 2 3.3 v/2.0a 6.6w pkf 2610a pi pkf 2610a si 5v/1.2a 6w pkf 2611 pi pkf 2611 si 5v/2.0a 10w pkf 2111a pi pkf 2111a si 12v/1.0a 12w pkf 2113a pi pkf 2113a si 1.8v/5a 9w pkf 4918b si 2.1v/1.5a 3w pkf 4310 pi pkf 4310 si 2.5v/4.4a 11w pkf 4919b si 3.3v/1.5a 5w pkf 4510 pi pkf 4510 si 3.3v/2.0a 6.6w pkf 4610a pi pkf 4610a si 3.3v/3.0a 9.9w pkf 4910a pi *) pkf 4910a si 3.3v/4.0a 13.2w pkf 4110b si 5v/1.2a 6w pkf 4611 pi pkf 4611 si 5v/2.0a 10w pkf 4111a pi **) pkf 4111a si 5v/3.0a 15w pkf 4211a pi pkf 4211a si 12v/0.6a 7w pkf 4713 pi pkf 4713 si 3.3 v/2.1a +5v/ 0.5a 9.4w pkf 4928a si +5v/1.0a -5v/ 1.0a 6w pkf 4622 pi pkf 4622 si +5v/1.0a +3.3v/ 1.0a 6w pkf 4628 pi pkf 4628 si +12v/0.5a -12v / 0.5a 6w pkf 4621 pi pkf 4621 si +12v/0.84a -12v / 0.84a 10w pkf 4121a si 3.3v/1.5a 5w pkf 5510 pi pkf 5510 si 5v/1.2a 6w pkf 5611 pi pkf 5611 si 7v/0.86a 6w pkf 5617 pi pkf 5617 si 12v/0.67a 8w pkf 5713 pi pkf 5713 si through hole *) pkf 4910a pi ns **) pkf 4111a pi ns ns = versions without synchronization function 18-75 vdc 18-36 vdc 36-75 vdc
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